Differential mems device and methods

ABSTRACT

A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

The present application is a continuation of U.S. patent applicationSer. No. 16/530,923 filed Aug. 2, 2019, now U.S. Pat. No. 11,255,871issued Feb. 22, 2022, which claims benefit of U.S. ProvisionalApplication No. 62/714,551 filed on Aug. 3, 2018, which are incorporatedin its entirety herein.

BACKGROUND OF THE INVENTION

The present invention relates to sensors. More specifically, the presentinvention relates to improving sensor performance with the use ofmultiple MEMS devices.

A constant challenge in the semiconductor space has been how to producea high performance device for a low cost (low consumer price). Anexample of this is seen with microprocessors, where an Intel Coreprocessor greatly outperforms an Intel Celeron processor, however ismuch more expensive. In the processor market, consumers often accepttradeoffs between processor performance and purchase price.

A similar challenge also applies in the case of sensors, e.g. MEMS-basedsensors including accelerometers, magnetometers, gyroscopes, pressuresensors e.g. microphones, and the like. More particularly, the challengeis how to produce a high-performance MEMS for a low cost. There aredifferences in the sensor market, however, in that because it is avolume business, the price sensitivity is much higher. High performanceMEMS devices are required at a low price.

In light of the above, what is desired are improved methods andapparatus to address the problem described above with reduced drawbacks.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to sensors. More specifically, the presentinvention relates to improving sensor performance with the use ofmultiple MEMS devices. Low cost sensor devices (e.g. MEMS) intended forconsumer applications, tend to have modest performance for parameterssuch as noise, temp coefficient, etc. In various embodiments, theperformance of such lower-cost devices are greatly improved by usingmultiple sensors to make them suitable for applications requiring higherperformance, such as for industrial applications

Embodiments of the present invention incorporate multiple MEMS devicesinto a single sensor device to improve performance of the sensor. Themultiple MEMS devices may be oriented in orthogonal directions, in someembodiments, however may be in virtually any orientation with respect toeach other. Further, the multiple MEMS devices may provide redundantdata, that may be averaged or integrated to provide the sensor output;the multiple MEMS devices may provide differential data, that mayfilter-out common mode movement or perturbation data; the multiple MEMSdevices may provide combination of redundant and differential data; andthe like. The MEMS devices may include accelerometers, gyroscopes,magnetometers.

According to one aspect of the invention, a sensor device is described.A system may include an initialization unit configured to simultaneouslyoutput a first initialization signal and a second initialization signal,in response to a master initialization signal, and a plurality oftri-axis MEMS sensors coupled to the initialization unit, wherein theplurality of tri-axis MEMS sensors comprises a first tri-axis MEMSsensor and a second tri-axis MEMS sensor, wherein the first tri-axisMEMS sensor is associated with a first spatial plane, wherein the secondtri-axis MEMS sensor is associated with a spatial second plane, whereinthe first spatial plane and the second spatial plane are not co-planar,wherein the first tri-axis MEMS sensor is configured to provide a firstset of data in response to a physical perturbation, wherein the secondtri-axis MEMS sensor is configured to provide a second set of data inresponse to the physical perturbation, wherein the first tri-axis MEMSsensor is configured to provide a first reply in response to the firstinitialization signal, wherein the second tri-axis MEMS sensor isconfigured to provide a second reply in response to the secondinitialization signal. An apparatus may include a controller coupled tothe initialization unit and to the plurality of tri-axis MEMS sensors,wherein the controller is configured to provide the master initiationsignal to the initialization unit, wherein the controller is configuredto receive the first reply at a first time period, wherein thecontroller is configured to receive the second reply at a second timeperiod, wherein the first time period and the second time period neednot be identical, wherein the controller is configured to determine alatency between the first time period and the second time period,wherein the controller is configured to receive the first set of dataand the second set of data, and wherein the controller is configured todetermine motion data in response to the first set of data, to thesecond set of data, and to the latency.

According to another aspect of the invention, a sensor device isdisclosed. A system may include a plurality of tri-axis MEMS sensorscomprising a first tri-axis MEMS sensor and a second tri-axis MEMSsensor, wherein the first tri-axis MEMS sensor is associated with afirst spatial plane, wherein the second tri-axis MEMS sensor isassociated with a spatial second plane, wherein the first spatial planeand the second spatial plane are not co-planar, wherein the firsttri-axis MEMS sensor is configured to provide a first interrupt inresponse to a physical perturbation, wherein the first tri-axis MEMSsensor is also configured to provide a first set of data in response tothe physical perturbation, wherein the second tri-axis MEMS sensor isconfigured to provide a second interrupt in response to the physicalperturbation, wherein the second tri-axis MEMS sensor is also configuredto provide a second set of data in response to the physicalperturbation. An apparatus may include a controller coupled to theplurality of tri-axis MEMS sensors, wherein the controller is configuredto receive the first interrupt at a first time period, wherein thecontroller is configured to receive the second interrupt at a secondtime period, wherein the first time period and the second time periodneed not be identical, wherein the controller is configured to determinea latency between the first time period and the second time period,wherein the controller is configured to receive the first set of dataand the second set of data, wherein the controller is configured todetermine motion data in response to the first set of data, to thesecond set of data, and to the latency.

According to yet another aspect of the invention, a method for a sensordevice is detailed herein. A technique may include simultaneouslyreceiving in a first tri-axis MEMS sensor and a second tri-axis MEMSsensor an initialization signal, wherein the first tri-axis MEMS sensoris associated with a first spatial plane, wherein the second tri-axisMEMS sensor is associated with a spatial second plane, wherein the firstspatial plane and the second spatial plane are not co-planar, outputtingfrom the first tri-axis MEMS sensor a first reply in response to theinitialization signal, and outputting from the second tri-axis MEMSsensor a second reply in response to the initialization signal. Aprocess may include receiving in a controller the first reply at a firsttime period, receiving in the controller the second reply at a secondtime period, wherein the first time period and the second time periodneed not be identical, determining in the controller, a latency betweenthe first time period and the second time period, outputting from thefirst tri-axis MEMS sensor a first set of data in response to a physicalperturbation, and outputting from the second tri-axis MEMS sensor asecond set of data in response to the physical perturbation. A methodmay include receiving in the controller the first set of data at a thirdtime period, receiving in the controller the second set of data at afourth time period, and determining in the controller motion data inresponse to the first set of data, to the second set of data, to thethird time period, to the fourth time period and to the latency.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more fully understand the present invention, reference ismade to the accompanying drawings. Understanding that these drawings arenot to be considered limitations in the scope of the invention, thepresently described embodiments and the presently understood best modeof the invention are described with additional detail through use of theaccompanying drawings in which:

FIG. 1 illustrates a configuration of embodiments of MEMS devices;

FIG. 2 illustrates another configuration of embodiments of MEMS devices;

FIG. 3 illustrates a block diagram of embodiments of variousembodiments;

FIG. 4 illustrates another block diagram of embodiments of variousembodiments;

FIG. 5 illustrates timing diagrams of embodiments of variousembodiments;

FIG. 6 illustrates timing diagrams of embodiments of variousembodiments; and

FIG. 7 illustrates a system block diagram of embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

In various embodiments of the present invention, three-axisaccelerometers provided by the inventors of the present invention arecharacterized by having low noise for X and Y axis since theses axis aretypically sensed using in-plane motion. Data from the X and Y axis tendto have less parasitic noise, etc. compared to data from Z axis sincethis axis is typically sensed using out of plane motion.

FIG. 1 illustrates various embodiments of the present invention. In thisfigure, a sensor 100 is illustrated having multiple MEMS devices 110(e.g. accelerometers) that are mounted substantially orthogonally 120with respect to each other. This type of mounting provides lower noisedata for the acceleration on the z-axis. In some embodiments, two ormore MEMS devices may be mounted on a substrate, e.g. three, four, five,six, or the like, and may be used to sense the perturbation. In variousembodiments of the present invention, post processing at a sensor-hubcan perform many operations, including: selection of a particular datastream for each axis, merging of data from multiple sensors tocompensate for effects of stress, temp coefficients, drift, etc. (e.g.averaging, integrating, differencing, etc.).

FIG. 2 illustrates a block diagram of embodiments of the presentinvention. More particularly FIG. 2 illustrates a sensor 200 havingthree different pairs of sensors: 210, 220, and 230. As illustrated,pairs of sensors 210, 220 and 230 are substantially orthogonal withrespect to each other and sensors (e.g. 212 and 214, 222 and 224, and232 and 234) are typically substantially parallel. In this embodiment,sets of differential data (240, 250 and 260) are obtained from pairs ofsensors 210, 220 and 230. As will be described below, a microcontroller,or the like receives data from pairs of sensors 210, 220 and 230 anddetermines physical perturbations based upon sets of differential data240, 250 and 260.

FIG. 3 illustrates an embodiment of the present invention. In thisfigure, a sensor 300 includes at least a first sensor 310 and a secondsensor 320, a clock 330 and a processing block 340. Sensors 310 and 320may be substantially orthogonal, substantially parallel, or skew withrespect to each other. In this embodiment, data from the differentsensors 310 and 320 that are to be merged or combined must besynchronized. An external clock or clock signal 350 is disclosed toprovide a common clock to sensors 310 and 320. The data 360 and 370provided by sensors 310 and 320 are synchronized and provided toprocessing block 340 for processing. In one embodiment, sensors 310 and320 can be synchronized at the system level. In various embodiments, theoutput data rate of clock 350 may be increased (e.g. doubled) so thatthe synchronization between data 360 and 370 may be made more precise.

FIG. 4 illustrates an embodiment of the present invention. In thisfigure, a sensor 400 includes at least a first sensor 410 and a secondsensor 420, a self-test mechanism 430 and a processing block 440.Sensors 410 and 420 may be substantially orthogonal, substantiallyparallel, or skew with respect to each other. In this embodiment, datafrom the different sensors 410 and 420 that are to be merged or combinedmust again be synchronized. In this embodiment, this is initiated byself-test or calibration mechanism 430. In various embodiments, sensors410 and 420 each have self-test mechanisms therein, that receive aself-test pulse or initiation command (e.g. via setting a register bit),and in response thereto, that generates a physical perturbation, e.g. avibration or movement along one or more axes of interest therein. Theself-generated perturbation or motion is then sensed by the othercomponents within each respective sensor. The sensed motion waveforms450 and 460 can be used to synchronize the data (e.g. multi-axis data)from the multiple sensors 410 and 420. In some embodiments, the delaybetween initiation of the self-test process until when sensed data isoutput is known, based upon design specification, typically ahead oftime. Accordingly, the synchronization can be performed more precisely.In some cases, the synchronization process may be performed once uponstart up, at regular intervals, upon demand, or every time to establishtime synchronization between multi-axis and multiple device data. As anexample, during normal use of the device, a self-test process may besimultaneously performed. In such an example, a modulation or frequencyfor perturbation motion for the self-test may be different from than thefrequency of the movement of the device while in normal use. Since thefrequencies may be different, the device could verify synchronizationbased upon the self-test frequency of the self-test process, while atthe same time obtaining perturbation data for the device at anotherfrequency.

Various sensor devices including embodiments of the present inventionmay include: multiple sensor devices (e.g. MEMS devices, accelerometers,etc.), an aggregator, sensor hub, microcontroller unit (MCU) orapplication processor chip for performing the function of establishingand maintaining time synchronization between multiple axes and multiplesensor devices.

FIGS. 5 and 6 illustrate timing diagrams according to examples ofembodiments. In the example in FIG. 5 , the integrated device is subjectto a physical perturbation A1 500 at time TOA 510.

In FIG. 5 , T11 520 represents the amount of time after A1 500, a firstsensor puts sensed data into an output register, T12 530 represents theamount of time after data is put into an output register until the firstsensor puts out an interrupt signal, and T13 540 represents the amountof time after the interrupt signal, until the MCU reads the sensed datafrom the first output register. Similarly, T21 550 represents the amountof time after A1, a second sensor puts sensed data into an outputregister, T22 560 represents the amount of time after data is put intoan output register until the second sensor puts out an interrupt signal,and T13 570 represents the amount of time after the interrupt signal,until the MCU reads the sensed data from the second output register. Thesum of T11 520, T12 530 and T13 540 and the sum of T21 550, T22 560 andT23 570 are used to characterize a latency between the first outputdevice and the second output device, such that the outputs can fused attime TOB 580 and be attributed to the same input perturbation at timeTOA 510.

In the example in FIG. 6 , the use of the self-test function isillustrated while the device is in normal operation. In this example,the integrated device is subject to a physical perturbation A1 600 attime TOA 610. In FIG. 6 , T11 620 represents the amount of time after A1600, a first sensor puts sensed data into a first output register, T12630 represents the amount of time after data is put into an outputregister until the MCU instructs the first sensor to perform aself-test, T13 640 represents the amount of time after the self-testsignal, until the first sensor responds to the self-test data, and T14650 represents the amount of time after the self-test data is responded,until data is read from the first output register. Similarly, T21 660represents the amount of time after A1, a second sensor puts sensed datainto a second output register, T22 670 represents the amount of timeafter data is put into an output register until the MCU instructs thesecond sensor to perform a self-test, T23 680 represents the amount oftime after the self-test signal, until the second sensor responds to theself-test data, and T24 690 represents the amount of time after theself-test data is responded, until data is read from the second outputregister.

In various embodiments, in FIGS. 6 , T11 620, T12 630, T13 640 and T14650 and T21 660, T22 670, T23 680 and T24 690 are used to characterize alatency between the first output device and the second output device,such that the first output and the second output can be attributed tothe same input perturbation or event at time TOA 610. As an example, T12630 and T13 640 may be summed and compared to the sum of T22 670 and T23680. In an ideal situation, these sums should be identical orsubstantially similar. If not, the difference may be used to adjust thedata output latency between these sensors. In various embodiments, whendata from more than two sensors are used, the differences between pairsof sensors can also be used to adjust data output latencies among thesensors.

FIG. 7 illustrates a functional block diagram of various embodiments ofthe present invention. More specifically, FIG. 7 illustrates a systemincluding embodiments of the present invention. In FIG. 7 , a computingdevice 600 typically includes some or all of the following: anapplications processor 610, memory 620, a touch screen display 630 anddriver 640, an image acquisition device 650, audio input/output devices660, a power supply (e.g. battery) and the like. Additionalcommunications from and to computing device may be provided by via awired interface 670, a GPS/Wi-Fi/Bluetooth interface 680, RF interfaces690 and driver 700, and the like. Also included in various embodimentsare physical sensors 710.

In various embodiments, computing device 600 may be a hand-heldcomputing device (e.g. Android tablet, Apple iPad), a smart phone (e.g.Apple iPhone, Google Nexus, Samsung Galaxy S), a portable computer (e.g.netbook, laptop, ultrabook), a media player, a reading device (e.g.Amazon Kindle), a wearable device (e.g. Apple Watch, Android watch,FitBit device, or other wearable device), appliances (e.g. washers,vacuum cleaners), autonomous or semi-autonomous vehicles, drones, or thelike.

Typically, computing device 600 may include one or more processors 610.Such processors 610 may also be termed application processors, and mayinclude a processor core, a video/graphics core, and other cores.Processors 610 may be a processor from Apple (e.g. A9), Qualcomm(Snapdragon), or the like. In other embodiments, the processor core maybe an Intel processor, an ARM Holdings processor such as the Cortex orARM series processors, or the like. Further, in various embodiments, thevideo/graphics core may be an ARM processor, Imagination Technologiesprocessor PowerVR graphics, an Nvidia graphics processor (e.g. GeForce),or the like. Other processing capability may include audio processors,interface controllers, and the like. It is contemplated that otherexisting and/or later-developed processors may be used in variousembodiments of the present invention.

In various embodiments, memory 620 may include different types of memory(including memory controllers), such as flash memory (e.g. NOR, NAND),pseudo SRAM, DDR

SDRAM, or the like. Memory 620 may be fixed within computing device 600or removable (e.g. SD, SDHC, MMC, MINI SD, MICRO SD, CF, SIM). The aboveare examples of computer readable tangible media that may be used tostore embodiments of the present invention, such as computer-executablesoftware code (e.g. firmware, application programs), application data,operating system data or the like. It is contemplated that otherexisting and/or later-developed memory and memory technology may be usedin various embodiments of the present invention.

In various embodiments, a touch screen display 630 and driver 640 may beprovided and based upon a variety of later-developed or current touchscreen technology including: resistive displays, capacitive displays,optical sensor displays, or the like. Additionally, touch screen display630 may include single touch or multiple-touch sensing capability. Anylater-developed or conventional output display technology may be usedfor the output display, such as TFT-LCD, OLED, Plasma, electronic ink(e.g. electrophoretic, electrowetting, interferometric modulating), orthe like. In various embodiments, the resolution of such displays andthe resolution of such touch sensors may be set based upon engineeringor non-engineering factors (e.g. sales, marketing). In some embodimentsof the present invention, a display output port, such as an HDMI-basedport, DVI-based port, or the like may also be included.

In some embodiments of the present invention, image capture device 650may be provided and include a sensor, driver, lens and the like. Thesensor may be based upon any later-developed or convention sensortechnology, such as CMOS, CCD, or the like. In various embodiments ofthe present invention, image recognition software programs are providedto process the image data. For example, such software may providefunctionality such as: facial recognition, head tracking, cameraparameter control, proximity detection, or the like.

In various embodiments, audio input/output 660 may be provided andinclude microphone(s)/speakers. In some embodiments of the presentinvention, three-wire or four-wire audio connector ports are included toenable the user to use an external audio device such as externalspeakers, headphones or combination headphone/microphones. In variousembodiments, voice processing and/or recognition software may beprovided to applications processor 610 to enable the user to operatecomputing device 600 by stating voice commands. Additionally, a speechengine may be provided in various embodiments to enable computing device600 to provide audio status messages, audio response messages, or thelike.

In various embodiments, wired interface 670 may be used to provide datatransfers between computing device 600 and an external source, such as acomputer, a remote server, a storage network, another computing device600, or the like. Such data may include application data, operatingsystem data, firmware, or the like. Embodiments may include anylater-developed or conventional physical interface/protocol, such as:USB, USB-C, Firewire, Apple Lightning connector, Ethernet, POTS, or thelike. Additionally, software that enables communications over suchnetworks is typically provided.

In various embodiments, a wireless interface 680 may also be provided toprovide wireless data transfers between computing device 600 andexternal sources, such as computers, storage networks, headphones,microphones, cameras, or the like. As illustrated in FIG. 8 , wirelessprotocols may include Wi-Fi (e.g. IEEE 802.11 a/b/g/n, WiMax),Bluetooth, IR, near field communication (NFC), ZigBee, ZWave, and thelike.

GPS receiving capability may also be included in various embodiments ofthe present invention, however is not required. As illustrated in FIG. 6, GPS functionality is included as part of wireless interface 680 merelyfor sake of convenience, although in implementation, such functionalityis currently performed by circuitry that is distinct from the Wi-Ficircuitry and distinct from the Bluetooth circuitry.

Additional wireless communications may be provided via RF interfaces 690and drivers 700 in various embodiments. In various embodiments, RFinterfaces 690 may support any future-developed or conventional radiofrequency communications protocol, such as CDMA-based protocols (e.g.WCDMA), GSM-based protocols, HSUPA-based protocols, or the like. In theembodiments illustrated, driver 700 is illustrated as being distinctfrom applications processor 610. However, in some embodiments, thefunctionality are provided upon a single IC package, for example theMarvel PXA330 processor, and the like. It is contemplated that someembodiments of computing device 600 need not include the RFfunctionality provided by RF interface 690 and driver 700.

FIG. 7 also illustrates computing device 700 to include physical sensors810. According to various embodiments, computing device 700 may includeconventional components such as a microcontroller or processor 710, amemory 720, a (optional) display and driver 730, a (optional) imageinput device 750, an (optional) audio input or output device 760, acommunications interface 770, a (optional) GPS/local interface 780, an(optional) RF interface and driver 7900, and the like.

In various embodiments of the present invention, physical sensors 810are multi-axis Micro-Electro-Mechanical Systems (MEMS) based devicesbeing developed by m-Cube, the assignee of the present patentapplication. Such sensors typically include very low power three-axissensors (linear, gyro or magnetic); ultra-low jitter three-axis sensors(linear, gyro or magnetic); low cost six-axis motion sensor (combinationof linear, gyro, and/or magnetic); ten-axis sensors (linear, gyro,magnetic, pressure); and various combinations thereof. As discussedabove, multiple physical sensors 810 may be used and be orientatedorthogonal to each other, and pairs of sensors 810 may be parallel toeach other. The data from physical sensors 810 may include differentialdata.

FIG. 7 is representative of one computing device 700 capable ofembodying the present invention. It will be readily apparent to one ofordinary skill in the art that many other hardware and softwareconfigurations are suitable for use with the present invention.Embodiments of the present invention may include at least some but neednot include all of the functional blocks illustrated in FIG. 7 . Forexample, in various embodiments, computing device 700 may lack one ormore of the above functional blocks, such as image acquisition unit 750,or RF interface 790 and/or driver or GPS capability, a user input device(e.g. keyboard), or the like. Further, it should be understood thatmultiple functional blocks may be embodied into a single physicalpackage or device, and various functional blocks may be divided and beperformed among separate physical packages or devices.

Further embodiments can be envisioned to one of ordinary skill in theart after reading this disclosure. For example, in some embodiments, asensor device including multiple sensors (e.g. MEMS devices) can beoperated at higher output data rates to allow finer adjustmentsynchronization between the devices.

In other embodiments, combinations or sub-combinations of the abovedisclosed invention can be advantageously made. In some examples,multiple sensors may also provide redundancy for critical applications.If one sensor is damaged or does not provide appropriate data, inresponse to a physical perturbation, the sensed data from the remainingsensors may be used to compensate for the loss of the one sensor. Instill other examples, environmental sensors, such as temperature,humidity, pressure, radiation sensors or the like may also beincorporated into a system, e.g. provided to the local processor. Suchdata may be used to compensate for temperature, temperature ofcoefficient offsets, temperature drift, radiation exposure of at leastone, but not all MEMS devices, and the like. In other embodiments,instead of relying upon self-test functionality, the manufacturer or theuser under specific conditions may provide a single perturbation event,e.g. a knock, a drop, or the like. According to such embodiments, thetime delay between the MCU receiving data from the different MEMSdevices based upon the event can then be used to determine a latencybetween these sensors. Similar to the above examples, the latency may beused to better synchronize data received from these MEMS devices goingforward in time.

The block diagrams of the architecture and flow charts are grouped forease of understanding. However, it should be understood thatcombinations of blocks, additions of new blocks, re-arrangement ofblocks, and the like are contemplated in alternative embodiments of thepresent invention. The examples and embodiments described herein are forillustrative purposes only and that various modifications or changes inlight thereof will be suggested to persons skilled in the art and are tobe included within the spirit and purview of this application and scopeof the appended claims.

What is claimed is:
 1. A sensor device comprising: a plurality of MEMSsensors comprising a first MEMS sensor and a second MEMS sensor, whereinthe first MEMS sensor is associated with a first spatial plane, whereinthe second MEMS sensor is associated with a spatial second plane,wherein the first MEMS sensor is configured to provide a first set ofdata in response to a physical perturbation, wherein the second MEMSsensor is configured to provide a second set of data in response to thephysical perturbation, wherein the first MEMS sensor is configured toprovide a first reply in response to a first initialization signal,wherein the second MEMS sensor is configured to provide a second replyin response to a second initialization signal; and a controller coupledto the plurality of MEMS sensors, wherein the controller is configuredto provide the first initialization signal to the first MEMS sensor andthe second initialization signal to the second MEMS sensor, wherein thecontroller is configured to receive the first reply at a first time,wherein the controller is configured to receive the second reply at asecond time, wherein the first time and the second time need not beidentical, wherein the controller is configured to determine a latencyin response to the first time and the second time, wherein thecontroller is configured to receive the first set of data and the secondset of data, and wherein the controller is configured to synchronize thefirst set of data and the second set of data to form motion data inresponse to the latency.
 2. The sensor device of claim 1 wherein thefirst MEMS sensor is different from the second MEMS sensor, and whereinthe first MEMS sensor is selected from a group consisting of: anaccelerometer, a gyroscope, a magnetometer.
 3. The sensor device ofclaim 1 wherein the first spatial plane and the second spatial plane areparallel; wherein the first set of data and the second set of data formdifferential data; and wherein the controller is configured to determinethe motion data in response to the differential data and to the latency.4. The sensor device of claim 1 wherein the first spatial plane and thesecond spatial plane are orthogonal.
 5. The sensor device of claim 1wherein the first MEMS sensor comprises a self-test circuit configuredto perform a self-test in response to the first initialization signal.6. The sensor device of claim 5 wherein the self-test circuit isconfigured to provide a self-test physical perturbation to the firstMEMS sensor in response to the first initialization signal; and whereinthe first MEMS sensor is configured to provide the first reply inresponse to the self-test physical perturbation.
 7. The sensor device ofclaim 1 wherein the motion data is characterized by a first noisefactor; wherein the first set of data is characterized by a second noisefactor; and wherein the first noise factor is smaller than the secondnoise factor.
 8. A sensor device comprising: a plurality of MEMS sensorscomprising a first MEMS sensor and a second MEMS sensor, wherein thefirst MEMS sensor is associated with a first spatial plane, wherein thesecond MEMS sensor is associated with a spatial second plane, whereinthe first MEMS sensor is configured to provide a first interrupt inresponse to a physical perturbation, wherein the first MEMS sensor isalso configured to provide a first set of data in response to thephysical perturbation, wherein the second MEMS sensor is configured toprovide a second interrupt in response to the physical perturbation,wherein the second MEMS sensor is also configured to provide a secondset of data in response to the physical perturbation; and a controllercoupled to the plurality of MEMS sensors, wherein the controller isconfigured to receive the first interrupt at a first time, wherein thecontroller is configured to receive the second interrupt at a secondtime, wherein the first time and the second time need not be identical,wherein the controller is configured to determine a latency between thefirst time and the second time, wherein the controller is configured toreceive the first set of data and the second set of data, wherein thecontroller is configured to synchronize the first set of data to thesecond set of data to form motion data in response to the latency. 9.The sensor device of claim 8 wherein the plurality of MEMS sensorscomprises a single type of MEMS sensor, wherein the single type of MEMSsensor is selected from a group consisting of: an accelerometer, agyroscope, and a magnetometer.
 10. The sensor device of claim 8 whereinthe first spatial plane and the second spatial plane are parallel;wherein the first set of data and the second set of data formdifferential data; and wherein the controller is configured to determinethe motion data in response to the differential data and to the latency.11. The sensor device of claim 8 wherein the first spatial plane and thesecond spatial plane are orthogonal.
 12. The sensor device of claim 8wherein the first MEMS sensor is selected from a group consisting of: atri-axis accelerometer and a tri-axis gyroscope.
 13. The sensor deviceof claim 8 wherein the first MEMS sensor is operated at a firstfrequency; wherein the second MEMS sensor is operated at a secondfrequency; and wherein the first frequency and the second frequency aredifferent.
 14. The sensor device of claim 8 wherein the controller isconfigured to receive the first set of data at a third time and thesecond set of data at a fourth time; and wherein the controller isconfigured to synchronize the first set of data to the second set ofdata to form the motion data in response to the third time, the fourthtime and the latency.
 15. A method for a sensor device comprising:receiving, in a first MEMS sensor, a first initialization signal, andreceiving, in a second MEMS sensor, a second initialization signal,wherein the first MEMS sensor is associated with a first spatial plane,wherein the second MEMS sensor is associated with a spatial secondplane; outputting, from the first MEMS sensor, a first reply in responseto the first initialization signal; outputting, from the second MEMSsensor, a second reply in response to the second initialization signal;receiving, in a controller, the first reply at a first time; receiving,in the controller, the second reply at a second time, wherein the firsttime and the second time need not be identical; determining, in thecontroller, a latency between the first time and the second time;outputting, from the first MEMS sensor, a first set of data in responseto a physical perturbation; outputting, from the second MEMS sensor, asecond set of data in response to the physical perturbation; receiving,in the controller, the first set of data at a third time; receiving, inthe controller, the second set of data at a fourth time; anddetermining, in the controller, motion data comprising the first set ofdata synchronized to the second set of data, in response to the thirdtime, the fourth time and to the latency.
 16. The method of claim 15wherein the first reply and the second reply are selected from a groupconsisting of: accelerometer data, gyroscope rotational data, andmagnetic data.
 17. The method of claim 15 wherein the first spatialplane and the second spatial plane are selected from a group consistingof: orthogonal planes, parallel planes.
 18. The method of claim 15further comprising: writing, with a microcontroller unit, the firstinitialization signal into a first register of the first MEMS sensor;and wherein the receiving, in the first MEMS sensor, the firstinitialization signal comprises reading, with the first MEMS sensor, thefirst initialization signal from the first register.
 19. The method ofclaim 15 wherein the first initialization signal comprises a firstself-test command; and wherein the outputting, from the first MEMSsensor, the first reply comprises outputting, from the first MEMSsensor, a self-test response in response to the first self-test command.20. The method of claim 19 wherein the outputting, from the first MEMSsensor, the self-test response comprises: providing, in the first MEMSsensor, a self-test physical perturbation in response to the firstself-test command; and determining, in the first MEMS sensor, theself-test response in response to the physical perturbation.